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Relatively high thermal conductivity of the substrate table
  • Substrate material
    (W/m*°K)
    Insulation(Ω×㎝)
    (0.25cm2  )  (W)
    Board size
  • Cost
  • FR4
    0.7~1.2
    1014
    0.2below
    To large-scale
  • MCPCB
    2~6
    108
    0.5~1
    To large-scale
  • LTCC
    8~15
    1013
    1~1.5
    No more 6"×6"
  • Al2-O3
    20~28
    1015
    2~3
    No more 6"×6"
  • SiC
    120~140
    108
    3~15
    No more 6"×6"
  • AlN
    140~180
    1011
    15~20
    No more 6"×6