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SiC block
SiC block
Detailed Description
Feature requirements
Why is Kallex better than others
Application
1. Grinding process of semiconductor silicon wafer
2. Grinding process of LED sapphire wafer
3. Thinning process of LED wafer
2. Grinding process of LED sapphire wafer
3. Thinning process of LED wafer
Feature requirements
1. Good thermal conductivity
2. Good thermal shock resistance
3. Good abrasion resistance
2. Good thermal shock resistance
3. Good abrasion resistance
Why is Kallex better than others
1. Available in various specifications, also provide customized services
2. Stable quality and fast delivery
3. SiC block diameter from 120mm to 480mm in stock
4. Save time of sample loading and unloading process
5. Acceptable higher thinning rate
2. Stable quality and fast delivery
3. SiC block diameter from 120mm to 480mm in stock
4. Save time of sample loading and unloading process
5. Acceptable higher thinning rate